BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//Photonics Finland - ECPv6.15.19//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-WR-CALNAME:Photonics Finland
X-ORIGINAL-URL:https://www.photonics.fi
X-WR-CALDESC:Events for Photonics Finland
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:Europe/Helsinki
BEGIN:DAYLIGHT
TZOFFSETFROM:+0200
TZOFFSETTO:+0300
TZNAME:EEST
DTSTART:20220327T010000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:+0300
TZOFFSETTO:+0200
TZNAME:EET
DTSTART:20221030T010000
END:STANDARD
BEGIN:DAYLIGHT
TZOFFSETFROM:+0200
TZOFFSETTO:+0300
TZNAME:EEST
DTSTART:20230326T010000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:+0300
TZOFFSETTO:+0200
TZNAME:EET
DTSTART:20231029T010000
END:STANDARD
BEGIN:DAYLIGHT
TZOFFSETFROM:+0200
TZOFFSETTO:+0300
TZNAME:EEST
DTSTART:20240331T010000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:+0300
TZOFFSETTO:+0200
TZNAME:EET
DTSTART:20241027T010000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART;TZID=Europe/Helsinki:20230620T090000
DTEND;TZID=Europe/Helsinki:20230620T173000
DTSTAMP:20260429T171103
CREATED:20230605T070419Z
LAST-MODIFIED:20230605T070420Z
UID:12201-1687251600-1687282200@www.photonics.fi
SUMMARY:PhotonHub training: Thick-SOI photonics for sensing and imaging
DESCRIPTION:Training description:Photonic integrated circuits (PICs) can be realized on many different technology platforms and used for numerous different applications. This course focuses on the so-called Thick-SOI platform and its use for sensing and imaging applications in the near and mid-infrared region. Primary focus is on 3 µm thick silicon-on-insulator (SOI) waveguide technology\, which is the most mature PIC technology platform at VTT. This platform is also available for small-to-medium volume contract manufacturing via VTT. Process design kits are available in multiple PIC design software platforms.   \n\n\n\n\n\n\n\nThis one-day hands-on training course provides an overview of the Thick-SOI PIC platform and its feasibility in sensing and imaging applications. A clean room tour in Micronova offers an overview of the used fabrication methods and facilities. Hands-on training includes 1) the design of 3 µm SOI PICs using PIC design software\, 2) wafer-level testing (WLT) in the clean room and 3) PIC testing in the photonics measurement lab. The last part includes semi-automated fiber-to-waveguide alignment\, optical beam steering with an optical phased array (OPA) and one sensing demonstration that vary from training to training and may include e.g. Faraday rotation in SOI waveguides or gas sensing with a tunable light source. \n\n\n\n \n\n\n\n\n\n\n\nTarget audience:It is desirable but not essential that course attendees have a basic understanding of photonics. The course is ideally suited to those planning to develop new photonic products based on low-loss PICs operating within the 1.2-6 µm wavelength range where the thick (µm-scale) SOI waveguides can operate. Training is primarily intended for industrial participants\, but also academic participants and students are welcome. \n\n\n\n \n\n\n\n \n\n\n\n \n\n\n\nPDF Slides about the event
URL:https://www.photonics.fi/event/photonhub-training-thick-soi-photonics-for-sensing-and-imaging/
LOCATION:Micronova\, Tietotie 3\, Espoo\, Finland
ATTACH;FMTTYPE=image/jpeg:https://www.photonics.fi/wp-content/uploads/2023/06/IMG_9991.jpg
END:VEVENT
END:VCALENDAR