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OPD2024 WEEK: PhotonHub Europe training: Thick-SOI photonics for sensing and imaging
May 27 @ 8:00 am – 5:00 pm EEST
Training description:
Photonic integrated circuits (PICs) can be realized on many different technology platforms and used for numerous different applications. This course focuses on the so-called Thick-SOI platform and its use for sensing and imaging applications in the near and mid-infrared region. Primary focus is on 3 µm thick silicon-on-insulator (SOI) waveguide technology, which is the most mature PIC technology platform at VTT. This platform is also available for small-to-medium volume contract manufacturing via VTT. Process design kits are available in multiple PIC design software platforms.
This one-day hands-on training course provides an overview of the Thick-SOI PIC platform and its feasibility in sensing and imaging applications. A clean room tour in Micronova offers an overview of the used fabrication methods and facilities. Hands-on training includes 1) the design of 3 µm SOI PICs using PIC design software, 2) a tour in the clean room and 3) PIC testing in the photonics measurement lab. The last part includes semi-automated fiber-to-waveguide alignment, optical beam steering with an optical phased array (OPA) and testing of silicon photonic chips.
Target audience:
It is desirable but not essential that course attendees have a basic understanding of photonics. The course is ideally suited to those planning to develop new photonic products based on low-loss PICs operating within the 1.2-6 µm wavelength range where the thick (µm-scale) SOI waveguides can operate. Training is primarily intended for industrial participants, but also academic participants and students are welcome.
Price:
Price is 100 € until 15th April (early-bird price) and 200 € after that.
See the PDF slides for the event HERE, and remember to make your registration HERE.
