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The 2023 IMAPS Nordic Microelectronic Packaging Conference and Exhibition, Nordpac
June 12 @ 8:00 am – June 14 @ 5:00 pm EEST
IMAPS Nordic and IEEE EPS would like to welcome you to NordPac 2023 in Oslo, Norway. NordPac will gather microelectronics packaging experts from Europe and the world to enjoy and discuss ground-breaking research in the field and bring industry and academia together.
Welcoming reception sponsored by SINTEF
Technical program including keynotes
Conference dinner at Holmenkollen
Technical program and best paper award
Abstract submission deadline is January the 31st 2023.
This year you can choose from three different tracks:
1) Track 1: a full paper submission (4-6 pages). Accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore’s scope and quality requirements. (http://ieeexplore.ieee.org/).
2) Track 2 will only require an extended abstract (1-2 pages) and will only be published in the conference proceedings.
3) Track 3 is reserved for commercial white papers (1-4 pages) and will only be published in the conference proceedings. Presentations from all three tracks can appear in the same technical session.
More information https://nordic.imapseurope.org/nordpac-2023-call-for-papers/ and @IMAPSNordic LinkedIn.