PHOSPACK is a Finnish Deep-Tech micro SME, with tangible engineering innovations and scientific advances in Photonic Packaging for Co-Packaged Optics (CPO) suitable for AI computing modules, datacom, and quantum applications. It´s contributing to the development of Electro Optical Multilayer Glass interposers, encompassing thermal management performances in 3D System-on-Package (SoP) applications.
High-density electro-optical interconnections and other core technologies are designed, developed and tested, implementing agile, iterative project phases, flexibility, and continuous improvement.
PHOSPACK has a Fabless structure, outsourcing manufacturing processes to highly specialised national and global partners. PHOSPACK is a reliable provider of advanced packaging technologies and design services, offering scalable solutions for advanced E/O Interconnections.
PHOSPACK Tmi was founded Nov. 2024, and registered in Lahti, Finland.
Contact
c/o Azets Insight Oy
Niemenkatu 73
15140 Lahti, Finland
+358 40 701 6494
info@phospack.com